Electroplated hard Cutting Blade for semicoductor
This series blades employs a new eletroformed technology realizes high performence,high level continuous processing of silicon,resistance,ceramic and semiconductor packaging material.
Application:Silicon ,GasAs ,Gap ,LiTa03 and other material.
1.deep cutting and grooving are possible using ultra-thin blades.
2.Blade thickness 0.015mm-0.1mm
3.wide range of grit sizes and bond types are avaliable to meet application requirement.
We believe that we will be your ideal partner